Solving the wireless connectivity bottleneck for AI data movement

WHAT WE DO

TeraSpatial is building wireless communications and networking solutions comprising silicon, software and deeply embedded AI/ML to solve the connectivity bottleneck for AI data movement

Our Unique Wireless Connectivity Offering Combines

Two Patented Technologies

The limitations of traditional networks

As GenAI is deployed across distributed and edge infrastructures, or where rapid deployment is needed, or where endpoints are not stationary, traditional connectivity will not meet the needs of high data rate use cases such as training, visualization, and digital twin.

The TeraSpatial Advantage: 10X Wireless Capacity

TeraSpatial’s connectivity solution uniquely solves this problem by delivering 10X wireless capacity compared to existing solutions, at 10X lower cost than deploying fiber.

Providing Connectivity for the Growing GenAI Market

Target customers include network/IT equipment providers for the infrastructure, enterprise, industrial, and government/defense segments, where GenAI is driving explosive demand for high-speed, low-latency data transport networks to disseminate data from physical interfaces to points of computation.

Markets and Applications

Public and Private 5G

Enterprise Connectivity for Edge AI

Government and Defense

OUR TEAM

Proven Industry Leaders and Domain Experts

Cormac S.G. Conroy

CEO and Co-Founder

Jeyanadh Paramesh

Chairman/CTO and Co-Founder

Ahmed Alkhateeb

Chief Scientist and Co-Founder

Dhinakar Gantala

SVP Engineering and Co-Founder

Cormac Conroy (CEO and Co-Founder) has 30 years of technology innovation and business experience. He was co-founder and CEO of Berkana Wireless, an RF/wireless chip startup acquired by Qualcomm. At Qualcomm, he served as VP, leading engineering and business for multiple wireless product lines. At Intel, as Corporate VP/GM, he led all of Intel’s client/device wireless engineering and business. He has 32 US Patents. He received the PhD degree from UC Berkeley.

Prof. Jeyanandh Paramesh (Chairman/CTO and Co-Founder), is an expert in the design and implementation of beamforming/MIMO communication systems. He has worked in for nearly 25 years in industry and academia and developed the first fully integrated phased arrays and hybrid beamforming MIMO systems in CMOS technology. He was previously a professor at Carnegie Mellon University, and has been employed at SpaceX, Motorola, Intel and Analog Devices/AKM Semiconductor, with many high-volume silicon products under his belt.

Prof. Ahmed Alkhateeb (Chief Scientist and Co-Founder), a leading researcher in AI/ML applied to wireless communications, and current faculty member at ASU, has worked on the application of AI/ML to wireless systems for >10 years. At Facebook Connectivity and ASU, he pioneered the application of AI/ML techniques in mmWave/massive MIMO. In addition to algorithms, has led the development of multiple prototypes and datasets.  He is the lead for the DeepMIMO and DeepSense 6G dataset initiatives. He received his PhD from UT Austin.

Dhinakar Gantala (SVP Engineering and Co-Founder) brings over 30 years of experience in the semiconductor industry, where he has led the development and commercialization of advanced wireless and communications silicon and software platforms. Previously, he held senior engineering roles at Marvell and Intel, and most recently led the global engineering team for the high volume iPhone11 smartphone chipset for Apple launched in 2019. He holds a graduate degree from the University of Central Florida.

In addition to the founders, the company’s team includes experts in wireless signal processing, DSP, AI/ML applied to wireless, RF and Mixed-Signal IC design, VLSI design, antenna design, wireless hardware systems, who have delivered leading-edge products at scale.

BOARD, OBSERVERS, SENIOR ADVISORS

Bruce Hallett

Board Member, TeraSpatial

William C. Weiss

Young K. Sohn

Sam Nakib

Heiner Sussner

Richard Curtin

Ross Lemire

Paul Voois

INVESTORS

PARTNERS AND INDUSTRY AFFILIATIONS

University Partners

U.S. Government Partners

Technology Partners

Corporate Partners

NEWS AND MEDIA

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About Sam

Sam Nakib is a seasoned semiconductor industry leader with over 35 years of experience at companies such as TI, IC Works, Cypress Semiconductor, and multiple startups. As a former President and CEO, he has successfully guided multiple startups from inception to profitable exits. His extensive background ranging from executive roles at multinational OEMs to founding and scaling innovative ventures makes him a key asset to our advisory board.